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Role of Na in solution-processed CuInSe 2 (CISe) devices: A different story for improving efficiency

机译:NA在解决方案加工的角色Cuinse 2 (CISE)设备:用于提高效率的不同故事

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摘要

Na has been believed to improve the device parameters of open circuit voltage (VOC) and fill factor (FF) presumably by increasing the carrier concentration (NA) of vacuum-processed Cu(In,Ga)Se2films. In solution-processed CI(G)Se devices as well, Na reportedly increases VOCand FF but this improvement is not correlated with the increase in NA,suggesting a different physical mechanism associated with Na in solution-based routes. In this contribution, experimental results on the role of Na addition in solution-processed CISe films and devices were reported, in which Na addition had no influence on NAnor on film composition in spite of the notable increase in the device efficiency. On the contrary, Na was found to mitigate the interfacial recombination by reducing the undesirable surface defects. Along with this understanding, Na addition in our air-processable route resulted in a CISe device with 12.83% efficiency, which is comparable to the current world record efficiency of solution-processed CISe devices.
机译:已经据信Na通过增加真空加工的Cu(In,Ga)Se2Films的载体浓度(Na)来改善开路电压(VOC)和填充因子(FF)的装置参数。在溶液处理的CI(G)SE器件中,NA据报道,NA增加了VOCAND FF,但这种改进与NA的增加没有相关,这表明基于溶液的路线中的NA相关的不同物理机制。在该贡献中,报告了对溶液加工的Cise膜和装置中Naa加入作用的实验结果,其中Na NaInde对薄膜组合物没有影响,尽管装置效率显着增加。相反,发现Na通过降低不希望的表面缺陷来减轻界面重组。随着这种理解,我们的空闲路由中的NA加入导致具有12.83%的CISE器件,效率为12.83%,与解决方案处理的CISE设备的当前世界记录效率相当。

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