首页> 外文期刊>MTT: Manufacturing Technology Today >EFFECT OF BONDING TEMPERATURE ON MICROSTRUCTURE AND MECHANICAL PROPERTIES OF AISI 304 TO Ti-6Al-4V DIFFUSION BONDED JOINTS
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EFFECT OF BONDING TEMPERATURE ON MICROSTRUCTURE AND MECHANICAL PROPERTIES OF AISI 304 TO Ti-6Al-4V DIFFUSION BONDED JOINTS

机译:粘合温度对AISI 304至Ti-6Al-4V扩散接头微观结构和力学性能的影响

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摘要

Solid state diffusion bonding (DB) of Ti-6Al-4V and AISI 304 were studied in the temperature range of 600-1000°C with a constant pressure of 12 MPa and holding time of 60 minutes. Micro hardness measurements and the lap shear test were carried out to determine the hardness and strength of the joints respectively. Maximum lap shear strength of 138 MPa was attained in the joint that was diffusion bonded using a temperature of 900°C, holding time of 60 min and a bonding pressure of 12 MPa. Optical microscopy and scanning electron microscopy (SEM) were used to examine the grain growth and the fine details of the interface structure.
机译:在600-1000℃的温度范围内研究了Ti-6AL-4V和AISI 304的固态扩散键合(DB),恒定压力为12MPa并保持60分钟的时间。 进行微硬度测量和搭接剪切试验以分别确定关节的硬度和强度。 在使用900℃的温度,保持60分钟的温度和12MPa的键合压力的温度和12MPa的粘合压力的粘合的关节中获得了138MPa的最大搭接剪切强度。 光学显微镜和扫描电子显微镜(SEM)用于检查晶粒生长和界面结构的细节。

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