机译:石墨薄片上的电镀Cu / Ni镀层及石墨片性能的影响/ Si / Al杂交复合材料的影响
Northwestern Polytech Univ MOE Key Lab Mat Phys &
Chem Extrodinary Condit Minist Educ Sch Sci Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ MOE Key Lab Mat Phys &
Chem Extrodinary Condit Minist Educ Sch Sci Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ MOE Key Lab Mat Phys &
Chem Extrodinary Condit Minist Educ Sch Sci Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ MOE Key Lab Mat Phys &
Chem Extrodinary Condit Minist Educ Sch Sci Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ MOE Key Lab Mat Phys &
Chem Extrodinary Condit Minist Educ Sch Sci Xian 710072 Shaanxi Peoples R China;
Northwestern Polytech Univ MOE Key Lab Mat Phys &
Chem Extrodinary Condit Minist Educ Sch Sci Xian 710072 Shaanxi Peoples R China;
Electroless plating; Metal matrix composites; Liquid infiltration; Thermal conductivity; Mechanical property;
机译:石墨薄片上的电镀Cu / Ni镀层及石墨片性能的影响/ Si / Al杂交复合材料的影响
机译:用Cu和Ni共沉积石墨薄片加固GF @ Cu / Si / Al复合材料的高导热系数
机译:石墨薄片粒径对石墨片/铜复合材料的微观结构和性能的影响
机译:用无电镀镀银片石墨填充导电粘合剂的性能
机译:用于导电应用的聚氨酯-炭黑-石墨杂化复合材料的制备和性能。
机译:Zr-Cu合金粉对高比对薄片石墨Cu基质复合材料微观结构及性能的影响
机译:石墨薄片表面下图石墨涂层的石墨片/ Cu复合材料的机械和热性能提高