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A Test Structure for the EMC Characterization of Small Integrated Circuits

机译:小集成电路EMC表征的测试结构

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摘要

This paper deals with the measurement methods used to evaluate the electromagnetic (EM) emission of integrated circuits (ICs) as well as their susceptibility to EM interference. In particular, the micro stripline method, which is prescribed by the International Electrotechnical Commission (IEC 62132-8), is considered and its limitations for the characterization of ICs encapsulated in small packages are highlighted. Wanting to address such issues, a new EM guiding structure that shows an enhanced coupling with the device under test in the frequency range 800 MHz-3 GHz is proposed. A circuit model of the test structure based on lumped elements that allows one to perform circuit analysis with SPICE-like simulators is proposed. It can also be used to check the effectiveness of the test bench before setting it up. The model has been validated comparing the scattering parameters obtained from simulations with those resulted from measurements carried out on a real test structure, which was designed and fabricated for this purpose.
机译:本文涉及用于评估集成电路(IC)的电磁(EM)排放的测量方法以及它们对EM干扰的易感性。特别地,考虑了由国际电工委员会(IEC 62132-8)规定的微型带状线法,并突出了其对小包装中封装的IC的表征的局限性。想要解决此类问题,提出了一种新的EM引导结构,其示出了与频率范围800MHz-3GHz的频率范围的测试中的设备增强耦合。提出了一种基于集体元件的测试结构的电路模型,其允许使用香料样模拟器执行电路分析。它还可以用于检查测试台之前的有效性。已经验证了该模型的比较从模拟中获得的散射参数与在真实测试结构上进行的测量结果中获得的散射参数,这是为此目的而设计和制造的。

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