INNOVATIVE INTERCONNECT TECHNOLOGIES FOR NEXT GENERATION IC PACKAGING

摘要

The past decade in the electronics industry in the electronics industry could be termed as an era of evolution of advanced portable electronics devices. It is the demand for such devices, which has driven much of the technology advances in the space. One important thing that has become notable in this development path is the importance of certain domains such as integrated circuit (IC) packaging have gained in the period evolution. An electronic chip package has come a long way from being a mere enclosure (ceramic, metal, or glass) that provides a housing for an IC on a silicon die. Over the past few years, an electronic package was considered to' be a passive part of the microelectronics component, which encloses the IC circuitry. Today, however, the packaging industry has significantly advanced, thanks to ongoing technological breakthroughs and fierce market demands. Packaging is now considered as a critical process step in the chip manufacturing flow. With a lot of packaging technology advances, the industry is continuously striving to map performance, application, and cost demands in an optimum way to serve the needs of the end users effectively. There are wide spread research ranging from materials to applications around the packaging technologies alone, which endorses the role of packaging in the industry today.