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Effect of the AlGaN/GaN Schottky barrier diodes combined with a dual anode metal and a p-GaN layer on reverse breakdown and turn-on voltage

机译:AlGaN / GaN肖特基势垒二极管与双阳极金属和P-GaN层相结合的效果在反向击穿和开启电压下

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AlGaN/GaN Schottky barrier diodes (SBDs) combined with a dual anode metal (ohmic and Schottky contacts) and a p-GaN layer were studied for improving the reverse breakdown voltage (V-BR) and reducing the turn-on voltage (V-ON). Structures with various distances of p-GaN layer (L-G) were investigated using the current-voltage (I-V), reverse recovery time, and voltage stress characteristics. The SBDs fabricated with L-G = 3 mu m realized a lower R-ON of 4.26 m ohm-cm(2) and lower V-ON of 0.10 V compared with the SBDs fabricated with L-G = 5 and 8 mu m as well as the standard device. Moreover, the V-BR of the SBDs with L-G = 3, 5, and 8 mu m was - 606, - 679, and - 713 V, respectively. The results indicated that the SBDs combined with a dual anode metal and a p-GaN layer have significantly improved V-BR than does of standard device. The reverse recovery time and reverse recovery charge of the SBD combined with a dual anode metal and a p-GaN layer design decreased due to the low noise and traps from the p-n junction.
机译:研究了与双阳极金属(欧姆和肖特基触点)结合的AlGaN / GaN肖特基势垒二极管(SBD),用于改善反向击穿电压(V-BR)并降低导通电压(V-在)。使用电流 - 电压(I-V),反向恢复时间和电压应力特性来研究具有各种P-GaN层(L-G)的结构的结构。用LG =3μm制造的SBD实现了4.26m欧姆-cm(2)的低于4.26m ohm-cm(2),与Lg = 5和8μm和标准制造的SBD相比,0.10V的低V-ON。设备。此外,具有L-G = 3,5和8μm的SBD的V-Br分别为-606,679和-713V。结果表明,与双阳极金属和P-GaN层相结合的SBD显着改善了V-BR的标准装置。 SBD的反向恢复时间和反向恢复电荷与双阳极金属和P-GaN层设计引起的,由于来自P-N结的低噪声和捕获量而降低。

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