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A Breakdown Enhanced AlGaN/GaN Schottky Barrier Diode with the T-Anode Position Deep into the Bottom Buffer Layer

机译:一个击穿增强的AlGaN / GaN肖特基势垒二极管,其中T阳极位置深入底部缓冲层

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摘要

In this paper, an AlGaN/GaN Schottky barrier diode (SBD) with the T-anode located deep into the bottom buffer layer in combination with field plates (TAI-BBF FPs SBD) is proposed. The electrical characteristics of the proposed structure and the conventional AlGaN/GaN SBD with gated edge termination (GET SBD) were simulated and compared using a Technology Computer Aided Design (TCAD) tool. The results proved that the breakdown voltage (VBK) in the proposed structure was tremendously improved when compared to the GET SBD. This enhancement is attributed to the suppression of the anode tunneling current by the T-anode and the redistribution of the electric field in the anode⁻cathode region induced by the field plates (FPs). Moreover, the T-anode had a negligible effect on the two-dimensional electron gas (2DEG) in the channel layer, so there is no deterioration in the forward characteristics. After being optimized, the proposed structure exhibited a low turn-on voltage (VT) of 0.53 V and a specific on-resistance (RON,sp) of 0.32 mΩ·cm2, which was similar to the GET SBD. Meanwhile, the TAI-BBF FP SBD with an anode-cathode spacing of 5 μm achieved a VBK of 1252 V, which was enhanced almost six times compared to the GET SBD with a VBK of 213 V.
机译:在本文中,提出了一种AlGaN / GaN肖特基势垒二极管(SBD),其与底部缓冲层深入的T型阳极与场板(Tai-BBF FPS SBD)组合。模拟并使用技术计算机辅助设计(TCAD)工具进行模拟并比较具有门控边缘终止(GET SBD)的所提出的结构和传统的AlGaN / GaN SBD的电气特性。结果证明,与GET SBD相比,所提出的结构中的击穿电压(VBK)在拟议的结构中得到了极大的改善。该增强归因于抑制由T-anode(FPS)引起的阳极静电区域中的T-anode和电场的再分布来抑制阳极隧道电流。此外,T阳极对通道层中的二维电子气(2deg)具有可忽略的影响,因此前向特性没有劣化。优化后,所提出的结构表现出0.53V的低导通电压(VT),以及0.32mΩ·cm2的特定导通电阻(RON,SP),其类似于GET SBD。同时,与阳极 - 阴极间距为5μm的Tai-BBF FP SBD实现了1252 V的VBK,与GBK为213 V的VBK相比,该VBK为1252 V的VBK。

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