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首页> 外文期刊>Materials science in semiconductor processing >Mechanism of mobility enhancement in Ge p-channel metal-oxide semiconductor field-effect transistor due to introduction of Al atoms into Sio(2)/Geo(2) gate stack
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Mechanism of mobility enhancement in Ge p-channel metal-oxide semiconductor field-effect transistor due to introduction of Al atoms into Sio(2)/Geo(2) gate stack

机译:由于Al原子引入SiO(2)/ Geo(2)栅极堆叠导致Ge P沟道金属氧化物半导体场效应晶体管的移动性增强机理

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In this paper, we present comprehensive results on Al-postmetallization annealing (Al-PMA) effect for the SiO2/GeO2 gate stack on a Ge substrate, which were fabricated by a physical vapor deposition method. The effective oxide thickness of metal-oxide-semiconductor (MOS) capacitor (CAP) was similar to 7 nm, and the Al-PMA was performed at a temperature in the range of 300-400 degrees C. The flat band voltage (V-FB), the hysteresis (HT), the interfacial states density (D-it), and the border traps density (D-bt) for MOSCAPs were characterized by a capacitance voltage method and a constant-temperature deep-level transient spectroscopy method. The MOSCAP without Al-PMA had an electrical dipole of similar to-0.8 eV at a SiO2/GeO2 interface, which was disappeared after Al-PMA at 300 degrees C. The HT, Dit, and Dbt were decreased after Al-PMA at 300 degrees C and were maintained in the temperature range of 300-400 degrees C. On the other hand, the VFB was monotonically shifted in the positive direction with an increase in PMA temperature, suggesting the generation of negatively charged atoms. Structural analyses for MOSCAPs without and with Al-PMA were performed by a time-of-flight secondary ion mass spectroscopy method and an X-ray photoelectron spectroscopy method. It was confirmed that Al atoms diffused from an Al electrode to a SiO2 film and reacted with GeO2. The dipole disappearance after Al-PMA at 300 degrees C is likely to be associated with the structural change at the SiO2/GeO2 interface. We also present the device performances of Al-gated p-channel MOS field-effect transistors (FET) with PMA treatments, which were fabricated using PtGe/Ge contacts as source/drain. The peak field-effect mobility (mu h) of the p-MOSFET was reached a value of 468 cm(2)/Vs after Al-PMA at 325 degrees C. The mu(h) enhancement was explained by a decrease in the total charge densities at/near the GeO2/Ge interface.
机译:在本文中,我们在Ge基板上对SiO2 / Geo2栅极堆叠的综合结果进行了全面的结果(Al-PMA)效果,通过物理气相沉积方法制造。金属氧化物 - 半导体(MOS)电容器(MOS)电容器(帽)的有效氧化物厚度类似于7nm,并且在300-400℃的温度下进行AL-PMA。平带电压(V- FB),滞后(HT),界面状态密度(D-IT)和媒介阶段的边界陷阱密度(D-BT)的特征在于电容电压方法和恒温深液位瞬态光谱法。没有Al-PMA的Moscap在SiO 2 / Geo2接口下具有类似于-0.8eV的电偶极子,在300摄氏度下在300摄氏度下在Al-PMA后消失。等级C并保持在300-400℃的温度范围内,另一方面,VFB随着PMA温度的增加,在正方向上单调地移动,表明产生带负电的原子的产生。通过飞行时间二次离子质谱法和X射线光电子体光谱法进行晶片的结构分析和Al-PMA的结构分析。证实,Al原子从Al电极扩散到SiO 2膜并与Geo2反应。在300摄氏度下Al-PMA后的偶极消失可能与SiO2 / Geo2接口的结构变化相关联。我们还提供了具有PMA处理的Al门控P沟道MOS场效应晶体管(FET)的装置性能,其使用PTGE / GE接触作为源/漏来制造。在325℃的Al-PMA之后,P-MOSFET的峰值场效应迁移率(mu H)达到468cm(2)/ vs的值。通过总量的减少解释了MU(H)增强电荷密度/附近GEO2 / GE接口。

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