ULTRASOUND HOLOGRAPHY FOR NANOSCALE SUBSURFACE IMAGING OF SEMICONDUCTOR STRUCTURES

摘要

As developments in the semiconductor industry progress towards smaller and smaller features, it becomes more and more challenging to ensure the quality of semiconductor products. "Current failure analysis techniques in the semiconductor industry are destructive techniques- you have to slice a sample, which unveils the internal structure, but simultaneously changes the properties of the sample characteristics," says Arvind Srivastava, principal scientist at US-based NanoSonix Inc.