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首页> 外文期刊>Experimental Mechanics >A Novel Grip Design for High-Accuracy Thermo-Mechanical Tensile Testing of Boron Steel under Hot Stamping Conditions
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A Novel Grip Design for High-Accuracy Thermo-Mechanical Tensile Testing of Boron Steel under Hot Stamping Conditions

机译:热冲压条件下硼钢高精度热机械拉伸试验的新型扶手设计

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Achieving uniform temperature within the effective gauge length in thermo-mechanical testing is crucial for obtaining accurate material data under hot stamping conditions. A new grip design for the Gleeble Materials-Simulator has been developed to reduce the long-standing problem of temperature gradient along a test-piece during thermo-mechanical tensile testing. The grip design process comprised two parts. For the first part, the new design concept was analysed with the help of Abaqus coupled Thermal-Electric Finite element simulation through the user defined feedback control subroutine. The second part was Gleeble thermo-mechanical experiments using a dog-bone test-piece with both new and conventional grips. The temperature and strain distributions of the new design were compared with those obtained using the conventional system within the effective gauge length of 40 mm. Temperature difference from centre to edge of effective gauge length (temperature gradient) was reduced by 56% during soaking and reduced by 100% at 700 A degrees C. Consequently, the strain gradient also reduced by 95%, and thus facilitated homogeneous deformation. Finally to correlate the design parameters of the electrical conductor used in the new grip design with the geometry and material of test-piece, an analytical relationship has been derived between the test-piece and electrical conductor.
机译:在热机械测试中实现均匀的温度在热机械测试中是在烫印条件下获得准确的材料数据至关重要。已经开发了一种新的GLEEBLE材料 - 模拟器的抓握设计,以在热机械拉伸试验期间减少温度梯度温度梯度的长期问题。握把设计过程包括两部分。对于第一部分,通过用户定义的反馈控制子程序的帮助,通过ABAQUS耦合的热电有限元模拟进行了新的设计概念。第二部分是使用具有新的和常规夹具的狗骨试验片的Gleeble热机械实验。将新设计的温度和应变分布与使用常规系统在40mm的有效规格长度内获得的温度和应变分布。从中心到边缘的温度差异长度(温度梯度)在浸泡过程中减少56%,并且在700℃下减少100%,因此应变梯度也减少了95%,因此促进了均匀变形。最后,为了将新的抓握设计中使用的电导体的设计参数与试验片的几何形状和材料相关联,在试验片和电导体之间得到了分析关系。

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