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首页> 外文期刊>European Physical Journal Plus >Thermal behavior of an active electronic dome contained in a tilted hemispherical enclosure and subjected to nanofluidic Cu-water free convection
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Thermal behavior of an active electronic dome contained in a tilted hemispherical enclosure and subjected to nanofluidic Cu-water free convection

机译:倾斜半球形外壳中包含的活性电子圆顶的热行为,经受纳米流体Cu-water对流

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摘要

This study examines the thermal behavior of a hemispherical electronic component subjected to a natural nanofluidic convective flow. During its operation, this active dome generates a high power, leading to Rayleigh number values reaching 4.56 x 10(9). It is contained in a hemispherical enclosure and the space between the dome and the cupola is filled with a monophasic water-based copper nanofluid whose volume fraction varies between 0 (pure water) and 10%. According to the intended application, the disc of the enclosure may be tilted at an angle ranging from 0 degrees to 180 degrees (horizontal disc with dome facing upwards and downwards, respectively). The numerical solution has been obtained by means of the volume control method. The surface average temperature of the dome has been determined for many configurations obtained by combining the Rayleigh number, the cavity's tilt angle and the nanofluid volume fraction which vary in wide ranges. The temperature fields presented for several configurations confirm the effects of natural convection. The results clearly highlight the effects of these influence parameters on the thermal state of the assembly. The study shows that some combinations of the Rayleigh-tilt angle-volume fraction are incompatible with a normal operating system at steady state and that a thermoregulation is required. The correlation of the temperature-Rayleigh-Prandtl-angle type proposed in this work allows to easily carry out the thermal dimensioning of the considered electronic assembly.
机译:本研究检查了经受自然纳米流体对流流程的半球形电子元件的热行为。在其操作期间,该活性圆顶产生高功率,导致瑞利数值达到4.56 x 10(9)。它包含在半球形外壳中,圆顶和圆顶醇之间的空间填充有一个单相水基铜纳米流体,其体积分数在0(纯水)之间变化和10%。根据预期的应用,外壳的盘可以以0度到180度的角度倾斜(分别朝向向上和向下的圆顶的水平盘)。通过体积控制方法获得了数值解决方案。已经确定了通过组合瑞利数,腔的倾斜角度和纳米流体体积分数而获得的许多配置的圆顶的表面平均温度。呈现多种配置的温度字段确认了自然对流的影响。结果清楚地突出了这些影响参数对组装热状态的影响。该研究表明,瑞利倾斜角度分数的一些组合与稳态处于正常操作系统,并且需要热调节。在该工作中提出的温度-Rayleigh-prandtl-角度类型的相关性允许容易地执行所考虑的电子组件的热尺寸。

著录项

  • 来源
    《European Physical Journal Plus 》 |2018年第3期| 共11页
  • 作者

    Bairi A.; Laraqi N.; Adeyeye K.;

  • 作者单位

    Univ Paris LTIE EA 4415 50 Rue Sevres F-92410 Ville Davray France;

    Univ Paris LTIE EA 4415 50 Rue Sevres F-92410 Ville Davray France;

    Univ Bath Dept Architecture &

    Civil Engn Bath BA2 7AY Avon England;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 物理学 ;
  • 关键词

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