A multi-scale conjugate thermal analysis methodology for convectively cooled electronic enclosures.

摘要

A novel multi-scale, integrated approach is developed for efficient thermal modeling of electronic systems. This involves setting up of coarse grid global (system level), and fine grid local (board and component level) models, and appropriate communication between the two. Several possible techniques for this communication have been evaluated and a preferred strategy has been adopted. The integrated modeling approach has been applied to one natural convection and two mixed and forced convection air-cooled configurations, populated with circuit cards containing discrete heating elements.;In order to reduce the computational effort in system level simulations, Symmetrically Coupled Gauss-Seidel (SCGS) based multigrid method has been implemented. Representation of components with reduced (or compact) models during system level analysis has also been studied. Reduced models with effective homogenized properties not only reduces number of grid points deployed for individual components, and significantly reduces the total number of grid points required for the system level modeling, but also smoothens the spatial variations in the thermal properties within the computational domain.;Experimental validation of the approach has been carried out for the two mixed and forced convection air-cooled configurations. Computations of the component junction temperature using the integrated approach were in good agreement with the measured values.