UV CURED ADHESIVE FEATURES HIGH GLASS TRANSITION TEMPERATURE

摘要

Master Bond, Hackensack, N.J., announces EP17HTND-CCM, a new single component epoxy that is not premixed or frozen. It is more convenient to handle, apply, and store compared to two-component glob top systems. This black, heat curable compound has a flowable paste consistency well suited for glob top, chip coating, and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is serviceable from -80 to +600°F [-62 to +316°C]. This adhesive forms high strength bonds to a wide variety of similar/dissimilar substrates such as metals, ceramics, plastics, composites, and various circuit board materials.