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首页> 外文期刊>International Journal of Thermophysics >Identification and Characterization of New Materials for Construction of Heating Plates for High-Temperature Guarded Hot Plates
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Identification and Characterization of New Materials for Construction of Heating Plates for High-Temperature Guarded Hot Plates

机译:高温防护热板加热板施工新材料的识别与表征

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摘要

The selection of a material for making the hot and cold plates of high-temperature guarded hot plates (HTGHPs) working up to 800 degrees C is still an issue. The material must be machinable, have a high mechanical stability to keep the high level of flatness of the plates and have a high thermal conductivity and a high resistance to oxidation when used in air. Nickel 201 alloy has been used in several instruments, but has shown, sometimes, problems of mechanical stability. The total hemispherical emissivity of the plates must be higher than 0.8 as recommended by the standards. Three ceramic materials, a silicon infiltrated silicon carbide (SiSiC), a machinable aluminum nitride and a sintered aluminum nitride (AlN) with high thermal conductivity claimed at ambient temperature, were selected for tests in thermal conductivity and opacity to thermal radiation. Three paints withstanding high temperatures were tested in total hemispherical emissivity and durability at high temperature. Above 600 degrees C, Nickel 201 alloy has a higher thermal conductivity than the three ceramics. Below 600 degrees C, the SiSiC and the sintered AlN have a thermal conductivity significantly higher than Nickel 201, but the sintered AlN shows a wide transparency spectral band at short wavelengths (below 6.5 mu m). Above 300 degrees C, the three paints have a total hemispherical emissivity above 0.8. One of the paints has polluted the specimens of an insulation material tested in thermal conductivity up to 650 degrees C. The other two can be recommended to coat the hot and cold plates of HTGHPs used up to 800 degrees C.
机译:用于制造高温和冷板的材料的选择仍然是一个问题。该材料必须是可加工的,具有高机械稳定性,以保持板的高水平平坦度并且在空气中使用时具有高导热率和高耐氧化抗性。镍201合金已用于多种仪器,但有时显示,有时是机械稳定性的问题。按照标准的建议,板的总半球发射率必须高于0.8。选择三种陶瓷材料,硅渗透的碳化硅(SISIC),在环境温度下施用高导热率的硅渗透碳化硅(SISIC),可加工的氮化铝和烧结铝(ALN),以在导热率和热辐射的不透射性中试验。在高温下以全半球发射率和耐久性进行三种耐高温测试。在600℃以上,镍201合金具有比三个陶瓷更高的导热性。低于600℃,套管和烧结ALN具有明显高于镍201的导热率,但烧结ALN在短波长(低于6.5μm)的宽透明光谱带。在300摄氏度以上,三种涂料的总半球发射率高于0.8。其中一个涂料污染了最高可达650℃的导热率测试的绝缘材料标本。另外两个可以建议涂覆高达800℃的HTGHPS的热和冷板。

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