Evaluation of Cutting Ability of Electroplated Diamond Wire Using a Test System and Theoretical Approach

摘要

Electroplated diamond wire has been used to cut hard materials, such as sapphire, silicon carbide, silicon. The cutting ability of the electroplated diamond wire strongly influences the accuracy of the shape and cutting speed. The evaluation of cutting ability of the electroplated diamond wire is important to predict and determine its cutting performance. However, the cutting ability has not been adequately evaluated due to a variation in the manufacturing methods and irregular distribution of the abrasives. A cutting ability curve is proposed base on a mathematical model and experimental results achieved through a test system to evaluate the performance of the electroplated diamond wire. The results showed that the cutting ability of the electroplated diamond wire could be characterized by the cutting ability curve proposed in this study.