Power-aware high level evaluation model of interconnect length of on-chip memory network topology

摘要

Interconnect power is the factor that dominates the power consumption on the on-chip memory architecture. Almost all dedicated wires and buses are replaced with packet switching interconnection networks which have become the standard approach to on-chip interconnection. Unfortunately, rapid advances in technology are making it more difficult to assess the interconnect power consumption of NoC. To resolve this problem, a new evaluating methodology for interconnect power evaluation based on topology of on-chip memory (IP-ETOM) is proposed in this paper. To validate this method, two multicore architectures 2D-mesh and triplet-based architecture (TriBA) are evaluated in this research work. The on-chip memory network model is evaluated based on characteristics of on-chip architecture interconnection. MATLAB is used for conducting the experiment that evaluates the interconnection power of TriBA and 2D-mesh.