A study on wettability and formation of intermetallic phase between Co-Cr-Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages

摘要

The wettability and formation of intermetallic compounds (IMCs) formed between a Co-Cr-Mo-based alloy and Sn-solder metal were investigated using the reflow soldering method. Soldering was conducted in an electric furnace in separate experiments at temperatures of 533, 553, 573, 623, and 673 K for 600 s. The morphology of the intermetallic layer formed at the Co-Cr-Mo-based/Sn-solder interface was characterized by scanning electron microscopy (SEM). The chemical composition and phase of the formed intermetallic layer were analyzed by electron probe microscopic analysis (EPMA) and X-ray diffraction analysis. Wettability analysis indicated that the soldering temperature influenced the wettability. With increasing soldering temperatures, the spreading factor increased, whereas the contact angle decreased. The intermetallic layers were found in triples in the intermediate zone between the solidified Sn-solder and the Co-Cr-Mo-based substrate. The thickness of the intermetallic layers increased in proportion with increasing soldering temperature. The EPMA analysis indicated only two IMCs formed at the interface of the joint at all of the investigated soldering temperatures, although three interfacial layers were observed by SEM analysis. The Sn-richer phase, Co(Cr,Mo)Sn-2, formed adjacent to the Sn-solder matrix, whereas the Co(Cr,Mo)Sn was found near the Co-Cr-Mo-based substrate. The nano-indentation measurement revealed that the formed Co(Cr,Mo)Sn-2 and Co(Cr,Mo)Sn IMCs possessed lower hardness values compared to the Sn-Cu intermetallic systems.