首页> 外文期刊>Industrial and organizational psychology >Reduced Bipolar Conduction in Bandgap-Engineered n-Type Cu0.008Bi2(Te,Se)(3) by Sulfur Doping
【24h】

Reduced Bipolar Conduction in Bandgap-Engineered n-Type Cu0.008Bi2(Te,Se)(3) by Sulfur Doping

机译:通过硫掺杂减少带隙工程的N型Cu0.008Bi2(TE,SE)(TE,SE)(TE,SE)(TE,SE)(3)的双极传导

获取原文
获取原文并翻译 | 示例
           

摘要

Significant bipolar conduction of the carriers in Bi2Te3-based alloys occurs at high temperatures due to their narrow bandgaps. Therefore, at high temperatures, their Seebeck coefficients decrease, the bipolar thermal conductivities rapidly increase, and the thermoelectric figure of merit, zT, rapidly decreases. In this study, band modification of n-type Cu0.008Bi2(Te,Se)(3) alloys by sulfur (S) doping, which could widen the bandgap, is investigated regarding carrier transport properties and bipolar thermal conductivity. The increase in bandgap by S doping is demonstrated by the Goldsmid-Sharp estimation. The bipolar conduction reduction is shown in the carrier transport characteristics and thermal conductivity. In addition, S doping induces an additional point-defect scattering of phonons, which decreases the lattice thermal conductivity. Thus, the total thermal conductivity of the S-doped sample is reduced. Despite the reduced power factor due to the unfavorable change in the conduction band, zT at high temperatures is increased by S doping with simultaneous reductions in bipolar and lattice thermal conductivity.
机译:由于其窄的带隙,Bi2Te3基合金中的载体的显着双极传导发生在高温下。因此,在高温下,它们的塞贝克系数减小,双极导电性迅速增加,并且功绩的热电数字,ZT,迅速降低。在该研究中,研究了可以扩大带隙的N型Cu0.008bi2(Te,Se)(3)合金的N型Cu0.008bi2(Te,Se)(3)合金的带状改性,其可以扩大带隙,并且关于载体传输性能和双极导热率。通过S掺杂的带隙的增加是通过Goldsmid-Quall估计来证明的。双极传导减少显示在载流子传输特性和导热性中。另外,S掺杂引起了声子的附加点缺陷散射,这降低了晶格导热率。因此,降低了S掺杂样品的总热导率。尽管由于导通带的不利变化而导致的功率因数降低,但在高温下ZT通过S掺杂增加,同时减少双极和晶格导热率。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号