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首页> 外文期刊>Anti-Corrosion Methods and Materials >Electrodeposition of Ni-W and Ni-W-P films using a pulse current technique and their application for hydrogen evolution in an acidic solution
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Electrodeposition of Ni-W and Ni-W-P films using a pulse current technique and their application for hydrogen evolution in an acidic solution

机译:使用脉冲电流技术的Ni-W和Ni-W-P膜的电沉积及其在酸性溶液中的氢气中的应用

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摘要

Purpose The improvement of the hydrogen evolution reaction (HER) performance requires more efficient and inexpensive electrocatalysts. The purpose of this study is to prepare Ni-W and Ni-W-P thin films using the electrodeposition technique using a pulse current and investigate their behaviors toward HER in an acidic solution. Design/methodology/approach The aim is to prepare Ni-W and Ni-W-P films by the electrodeposition technique using a pulse current and estimate their performance for the HER. The surface morphologies and chemical compositions of the deposited films were assessed using scanning electron microscopy, energy-dispersive X-ray analysis and X-ray diffraction. Linear sweep voltammetry, chronoamperometry, Tafel plots and electrochemical impedance spectroscopy were used to evaluate the prepared electrodes toward the hydrogen evolution process. Findings The main conclusion is that the surface morphology of Ni-W deposited film is a crystalline structure, while that of Ni-W-P deposit is an amorphous structure. HER activity on Ni-W electrodes increases with decreasing the Wt.% of W to 7.83 Wt.% in the prepared electrodes. In addition, the presence of P enhances HER activity, which increases with increasing the Wt.% of P in the prepared Ni-W-P electrodes. Both Ni-W (7.83 Wt.% W) and Ni-W-P (20.34 Wt.% P), which have been prepared at 8 A dm(-2) display the best performance toward HER compared to the other prepared electrodes. They exhibit high catalytic activities toward HER, which is evidenced by high hydrogen evolution current density values of 9.52 and 33.98 mA cm(-2), low onset potentials of -0.73 and -0.63 V, low Tafel slopes of -125 mV/dec, high exchange current densities of 0.058 and 0.20 mA cm(-2), low charge transfer resistances (Rct) of 226.28 and 75.8 ohm center dot cm(2) for Ni-W (7.83 Wt.% W) and Ni-W-P (20.34 Wt.% P), respectively; moreover, they exhibited considerable stabilities too. Originality/value The results presented in this work are an insight into understanding the performance of the prepared Cu electrodes coated by Ni-W and Ni-W-P films toward HER. In this work, a consistent assessment of the results achieved on laboratory scale has been conducted.
机译:目的,改善氢进化反应(她)性能需要更有效且廉价的电催化剂。本研究的目的是使用使用脉冲电流的电沉积技术制备Ni-W和Ni-W-P薄膜,并在酸性溶液中调查它们对她的行为。设计/方法/方法目的是通过使用脉冲电流的电沉积技术制备Ni-W和Ni-W-P膜,并估计其对她的性能。使用扫描电子显微镜,能量分散X射线分析和X射线衍射评估沉积膜的表面形态和化学组成。线性扫描伏安法,计时率,TaFel图和电化学阻抗光谱法用于评估制备的电极朝向氢化过程。结果主要结论是Ni-W沉积膜的表面形态是结晶结构,而Ni-W-P沉积物的表面形态是无定形结构。她在Ni-W电极上的活性随着Wt的增加而增加。在制备的电极中的W至7.83重量%。另外,P的存在增强了她的活性,随着增加的Ni-W-P电极中的P.%的P%增加。在8A DM(-2)的Ni-W(7.83重量%W)和Ni-W-P(20.34重量%p)中已经制备的,与其他制备的电极相比,对其显示最佳性能。它们对她表现出高催化活性,这是通过9.52和33.98 mA cm(-2)的高氢进化电流密度值来证明-0.73和-0.63 V,低TAFEL斜率为-125 mV / dec, 0.058和0.20mA(-2)的高交换电流密度,低电荷转移电阻(RCT)为226.28和75.8欧姆中心点CM(2),用于Ni-W(7.83重量%W)和Ni-WP(20.34重量%p)分别;此外,它们也表现得相当大的稳定性。原创性/值在本工作中提出的结果是了解理解由Ni-W和Ni-W-P薄膜涂覆的制备的Cu电极的性能。在这项工作中,已经进行了对实验室规模所取得的结果的一致评估。

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