sSiO 2/ mSiO 2 composite particles: The effect of the core size on oxide chemical mechanical polishing]]>

摘要

Graphical abstractDisplay OmittedHighlights?The core/shellsSiO2/mSiO2particles with controlled core sizes were obtained.?The dependence of oxide CMP performance on the core size was investigated.?The mesoporous silica shells contributed to the scratch reduction.?The surface roughness of the finished wafers increased as the core size increased.?The removal rate was related to the total contact area and indentation depth.AbstractIn a typical chemical mechanical polishing (CMP) process, the type, morphology, structure, mechanical, and surface characteristics of abrasive particles play an important role in influencing the material removal process. The novel abrasive particles with special mechanical and/or tribochemical properties have been introduced into CMP processes for the improvement of surface quality and finishing efficiency. In this work, the composite particles containing solid silica (sSiO2) cores and mesoporous silica (mSiO2) shells were preparedviaa developed St?ber method using cetyltrimethylammonium bromide as a structure-templating surfactant. The as-synthesized core/shell structuredsSiO2/mSiO2composite particles were characterized by powder X-ray diffraction, field emission scanning electron microscopy, transmission electron microscopy, and nitrogen sorption–desorption measurements. The effect of thesSiO2core size of the composite particles on oxide CMP performance was evaluated in terms of surface roughness and material removal rate (MRR). The root-mean-square surface roughness (0.15–0.31nm) of the polished substrates slightly increased with increasing of thesSiO2core size (168–353nm) of the composites with a comparablemSiO2shell thickness (16–18nm). ThesSiO2/mSiO2composite particles with a relatively smaller or larger core presented a relatively highMRRfor silicon oxide films. These oxide CMP results could be rationalized according to t