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Surface morphology, structural and electrical properties of RF-sputtered ITO thin films on Si substrates

机译:Si基材RF溅射ITO薄膜的表面形态,结构和电性能

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Series of indium tin oxide (ITO) thin films were deposited onto Si(100) substrate by RF sputtering. The film thickness ranges from 61 to 768 nm. X-ray diffraction (XRD), scanning electron microscopy (SEM) and atomic force microscopy (AFM) experiments were performed to study the structure and the surface morphology of these films. The electrical properties were obtained by a Hall effect measurement system; the electrical resistivity , the carrier concentration n and the mobility were measured. Annealing experiments were carried out in the air at for 60 min. The different physical parameters were investigated as a function of thickness before and after annealing. The effects of power and deposition rate were also addressed. We noted that the behaviour of some parameters with thickness is different before and after annealing. All these results are discussed and correlated in this article. Also, the results of the present ITO/Si system were compared to those of the ITO/glass, we have previously published.
机译:通过RF溅射将氧化铟锡(ITO)氧化钛(ITO)薄膜沉积在Si(100)衬底上。薄膜厚度范围为61至768nm。进行X射线衍射(XRD),进行扫描电子显微镜(SEM)和原子力显微镜(AFM)实验,以研究这些薄膜的结构和表面形态。通过霍尔效应测量系统获得电性能;测量电阻率,载流子浓度N和迁移率。退火实验在空气中进行60分钟。在退火前后的厚度的函数中研究了不同的物理参数。还解决了电力和沉积率的影响。我们注意到,在退火之前和之后,一些参数的行为不同。本文讨论和相关的所有这些结果。此外,与ITO /玻璃的结果进行了比较了本ITO / SI系统的结果,我们以前发表过。

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