机译:通过磁控溅射沉积的Cu层接触Al7075合金的无功钎焊
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Harbin 150001 Heilongjiang Peoples R China;
Contact reactive brazing; 7075 alloy; Surface oxide film; Microstructure; Mechanical properties;
机译:通过磁控溅射沉积的Cu层接触Al7075合金的无功钎焊
机译:反应性直流磁控溅射沉积纳米结构Cr2Nx / Cu多层膜的表征
机译:TiAlCN / VCN纳米层涂层,适用于通过组合高功率脉冲磁控溅射/不平衡磁控溅射沉积的Al和Ti合金
机译:通过具有单个合金化靶的反应磁控溅射工艺沉积纳米复合材料Mo-Cu-n涂层
机译:通过反应磁控溅射沉积的亚稳态钛(0.5)铝(0.5)铝合金薄膜的物理性能。
机译:反应堆磁控溅射沉积p型缺铜Cu Cr0.95-xMg0.05 O2薄膜的光电性能
机译:磁控溅射沉积Ti-Cu纳米复合薄膜的硝化