The effect of process vibrations under different rotational rates on the non-uniform material removal during continuous polishing

摘要

This research illustrates the effect of process vibrations under different rotational rates on the non-uniform material removal, which is characterized by the MRR/v and removed material distribution (RMD) during the continuous polishing. To quantitively calculate the removed material thickness of points on the workpiece, a novel RMD model considering the kinematic parameters, dynamic pressure and the process vibrations is proposed. Several polishing experiments are conducted under different rotational rates. The process vibrations are enhanced by higher rotational rate, resulting in higher MRR/v and fluctuations in the profile of measured RMD. Furthermore, the percentage of error in radial removed thickness (ERRT) to the average removed thickness on the whole workpiece surface is defined to evaluate the accuracy of the RMD model.