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Calculations of material removal, removal rate, and Preston coefficient in continuous lapping / polishing machines

机译：连续研磨机中的材料去除，移除率和普雷斯顿系数的计算

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1. The effect of process vibrations under different rotational rates on the non-uniform material removal during continuous polishing [J] . Journal of Materials Processing Technology . 2020,第期

机译：在连续抛光过程中不同旋转速率下的工艺振动对不均匀材料去除的影响
2. A case for 2-body material removal in prime LED sapphire substrate lapping and polishing [J] . John J. Gagliardi, Don Kim, Jennifer J. Sokol, Journal of Manufacturing Processes . 2013,第3期

机译：一次LED蓝宝石衬底研磨和抛光中的2体材料去除案例
3. A novel functionally graded lapping and polishing method for the improvement of material removal uniformity [J] . Journal of Manufacturing Processes . 2020,第Feba期

机译：一种新型的功能分级研磨抛光方法，用于改善材料去除的均匀性
4. A Case for 2-Body Material Removal in Prime LED Sapphire Substrate Lapping and Polishing [C] . John J. Gagliardi, Don Kim, Jennifer J. Sokol, Proceedings of the North American Manufacturing Research Institution of the Society of Manufacturing Engineers . 2012

机译：优质LED蓝宝石基板研磨和抛光的2体材料去除案例
5. Chemical mechanical planarization: Synchronous, in situ measurements of the coefficient of friction, wafer orientation and material removal rate. [D] . Vlahakis, James K. 2008

机译：化学机械平面化：摩擦系数，晶片取向和材料去除速率的同步，原位测量。
6. Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping [O] . Yong Hu, Dong Shi, Ye Hu, 2018

机译：超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
7. Calculations of material removal, removal rate, and Preston coefficient in continuous lapping/polishing machines [O] . P.P. Hed 1993

机译：连续研磨机中的材料去除，移除率和普雷斯顿系数的计算
8. Calculations of material removal, removal rate, and Preston coefficient in continuous lapping/polishing machines. [R] . Hed, P. P. 1993

机译：连续研磨/抛光机中材料去除，去除率和preston系数的计算。

Calculations of material removal, removal rate, and Preston coefficient in continuous lapping / polishing machines

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