机译:高电流密度下共晶SN-37PB圈关节的微观结构演化与迁移机制研究
Xiamen Univ Dept Mat Sci &
Engn Coll Mat Fujian Key Lab Adv Mat Xiamen 361005 Peoples R China;
Xiamen City Univ Sch Mech &
Automat Engn Xiamen 361005 Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Shenzhen Grad Sch Shenzhen 518055 Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Shenzhen Grad Sch Shenzhen 518055 Peoples R China;
Harbin Inst Technol State Key Lab Adv Welding &
Joining Shenzhen Grad Sch Shenzhen 518055 Peoples R China;
Xiamen Univ Dept Mat Sci &
Engn Coll Mat Fujian Key Lab Adv Mat Xiamen 361005 Peoples R China;
Xiamen Univ Dept Mat Sci &
Engn Coll Mat Fujian Key Lab Adv Mat Xiamen 361005 Peoples R China;
Electromigration; microstructure; solder; phase segregation; reliability;
机译:高电流密度下共晶SN-37PB圈关节的微观结构演化与迁移机制研究
机译:高电流密度下Sn-37Pb和Sn-3.0Ag-0.5Cu倒装芯片焊点中的电迁移行为
机译:通过扩散键合制造的AlcoCrfeni_(2.1)共晶高熵合金接头的微结构演化,粘接机理和力学性能
机译:高电流密度下SnBi共晶焊点的组织演变和温度分布的研究
机译:接近共晶锡银铜焊料接头的微观结构演变的表征和建模。
机译:铜基焊丝与预热TC4 / 304不锈钢接头的焊接形成机理及组织演变
机译:共晶AU-SN焊点的微观结构演化
机译:共晶au-sn焊点的微观结构演变