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首页> 外文期刊>Journal of Electronic Materials >Prediction of fatigue failure of 60Sn-40Pb solder using constitutive model for cyclic viscoplasticity
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Prediction of fatigue failure of 60Sn-40Pb solder using constitutive model for cyclic viscoplasticity

机译:使用循环粘塑构成模型预测60sn-40pb焊料的疲劳失效

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摘要

This paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify theapplicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposedconstitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can bepredicted using the plastic strain work density per unit time.
机译:本文使用来自所提出的环状粘塑性模型计算的每个单位时间计算的塑料应变工作密度来对60sn-40pb焊料合金的疲劳寿命预测。 首先,为了验证所提出的本构型模型的替代性,以使60Sn-40PB焊料合金的变形,一系列基本实验,例如蠕变试验和循环张力 - 压缩负载测试在303K,323K,343K处进行。 然后,采用拟合概念模型来预测焊料合金的疲劳失效。 结果,阐明了所提出的本构模型适用于解释焊料合金的粘性变形,并且可以使用每单位时间的塑料应变工作密度受到疲劳失效。

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