首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >The pH-dependent corrosion behavior of ternary oxide semiconductors and common metals and its application for solution-processed oxide thin film transistors circuit integration
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The pH-dependent corrosion behavior of ternary oxide semiconductors and common metals and its application for solution-processed oxide thin film transistors circuit integration

机译:三元氧化物半导体和普通金属的pH依赖性腐蚀行为及其对溶液加工氧化物薄膜晶体管电路集成的应用

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摘要

Individual oxide semiconductors and metals experience unique pH-dependent phase-transition into natively stable phases (metal, metal ions, or oxide phases) in various acidic and basic solutions. Thus, the corrosion behavior of oxide semiconductors and metals can be engineered by controlling pH values. In particular, the specific pH value induced interesting corrosion behavior that oxide semiconductor becomes chemically-stable and metal solely experiences active ionization. First, the pH-dependent corrosion behavior of ternary oxide semiconductors [ZnSnO (ZTO) and InZnO (IZO)] and common metals (Mo and Mo/Cu) was explored based on theoretical Pourbaix diagram and experimental corrosion data. Next, the pH-dependent corrosion behavior based back-channel wet-etch (BCWE) process using pH-controlled wet etchants was designed and applied for chemical damage-, metal residue-, and curing treatment-free solution-processed oxide thin film transistors (TFTs) circuit integration without electrical degradation. Thick-Mo and thin-Mo/thick-Cu could be completely ionized without any metal oxide residues in middle-basic (pH >= 10) and weak-acidic (pH = 6) wet-etchants, respectively. Chemically durable ZTO in the broad pH region (6 <= pH <= 11) indicated sufficient potential as channel candidates for the circuit integration of chemical damage- free oxide TFTs as opposed to IZO (pH = 10). Finally, solution-processed ZTO TFTs could be fabricated with wet-etched Mo and Mo/Cu using the customized wet-etchant condition (pH = 10 and 6) without electrical degradation (current-drop, hump phenomena, or instability) that was inevitably generated in a conventional BCWE. (C) 2017 Elsevier B. V. All rights reserved.
机译:个体氧化物半导体和金属在各种酸性和碱性溶液中经历独特的pH依赖性相转移到本地稳定的阶段(金属,金属离子或氧化物相)中。因此,可以通过控制pH值来设计氧化物半导体和金属的腐蚀行为。特别地,氧化物半导体变化稳定的特异性pH值诱导的有趣腐蚀行为,并且金属单独经历活性电离。首先,基于理论产物图和实验腐蚀数据,探讨了三元氧化三元半导体[ZnSNO(ZtO)和inzno(IZO)]和普通金属(Mo和Mo / Cu)的pH依赖性腐蚀行为。接下来,设计并施加使用pH控制的湿蚀刻剂的基于pH依赖性腐蚀行为的基于后通道湿法蚀刻(Bcwe)方法,用于化学损伤,金属残留物和固化的免溶液加工氧化物氧化膜晶体管(TFT)电路集成而无需电降级。厚-Mo和薄-0 /厚-Cu可以完全电离,没有中碱(pH> = 10)和弱酸性(pH = 6)湿蚀刻剂的任何金属氧化物残基。在宽pH区(6 <= pH <= 11)中的化学耐久性ZtO表示充分潜力作为电路候选化学损伤的氧化物TFT的通道候选,而不是IZO(pH = 10)。最后,可以使用不可避免地的定制湿蚀刻剂条件(pH = 10和6),用湿法蚀刻的Mo和Mo / Cu制造溶液加工的ZtO TFT,没有电降级(电流降低,驼峰现象或不稳定),这是不可避免的在传统的BCWE中生成。 (c)2017 Elsevier B. V.保留所有权利。

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