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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Oxygen partial pressure ratio modulated electrical performance of amorphous InGaZnO thin film transistor and inverter
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Oxygen partial pressure ratio modulated electrical performance of amorphous InGaZnO thin film transistor and inverter

机译:无定形Ingazno薄膜晶体管和逆变器的氧分压比调制电性能

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In this work, sputtering route has been pursued for the deposition of amorphous InGaZnO thin films under different oxygen partial pressure ratio (O-ppr). The effect of oxygen partial pressure ratio on the microstructure, optical and electrical properties and chemical bonding states of the sputtering-derived amorphous indium-gallium-zinc oxide (alpha-IGZO) thin films have been investigated by X-ray diffraction, X-ray photoelectron spectroscopy, UV-vis spectroscopy, and a series of electrical measurements. Measurements based on alpha-IGZO/SiO2 thin film transistors (TFTs) have shown that oxygen partial pressure ratio can effectively regulate the carrier concentration, the defect trap density in the bulk channel and the interface between the channel and the gate insulator. The appropriate oxygen partial pressure ratio can reduce interface trap density (N-it) and decrease the off-state current (I-off), which can obviously improve the on/off current ratio (I-on/I-off) and the stability of the device. In addition, the appropriate oxygen partial pressure ratio increases the overlap of the ns-orbit of metal ions in the film, which is conducive to improve the electronic transport routes and increase the carrier mobility. As a result, the optimized TFTs performance with oxygen partial pressure ratio of 6.3% has been achieved, including a high saturation mobility (mu(sat)) of 9.9 cm(2)V(-1)S(-1), a large on/off current ratio of 3.5 x 10(9), a small subthreshold swing (SS) of 0.29 V/decade, a threshold voltage shift of 4V under positive bias stress for 7200 s, respectively. A resistor loaded inverter was also constructed on alpha-IGZO/SiO2 TFTs and exhibited full swing characteristics with a high gain of 10.3, which is sufficient to drive the next stage component in a logic circuit. All the experimental results have indicated that the sputtering-derived alpha-IGZO thin films have potential application in large-area all-oxide flexible electronics. (C) 2018 Elsevier B.V. All rights reserved.
机译:在这项工作中,溅射途径已经追求在不同氧分压比下(O-PPR)下的无定形Ingazno薄膜沉积。通过X射线衍射研究了氧气分压与溅射衍生的非晶铟 - 镓 - 氧化锌(α-IGZO)薄膜的微观结构,光学和电性能和化学粘合状态的影响,X射线光电子光谱,UV-Vis光谱和一系列电测量。基于α-IGZO / SIO2薄膜晶体管(TFT)的测量表明,氧分压比可以有效地调节载流子浓度,散装通道中的缺陷阱密度和通道和栅极绝缘体之间的界面。适当的氧气分压比可以减少接口捕集密度(n-it)并降低截止状态电流(I-OFF),这明显改善了开/关电流比(I-ON / I-OFF)和设备的稳定性。另外,适当的氧分压比增加了薄膜中金属离子的NS-轨道的重叠,这有利于改善电子传输路线并增加载流子迁移率。结果,已经实现了具有氧分压比为6.3%的优化TFT性能,包括高饱和迁移率(MU(SAT))为9.9cm(2)V(-1)S(-1),一个大开/关电流比为3.5×10(9),小亚阈值摆动(SS)为0.29 V /十年,分别为7200秒的正偏压应力下4V的阈值电压移位。电阻器负载的逆变器也在α-IGZO / SiO 2 TFT上构造,并且具有高增益的完全摆动特性为10.3,足以在逻辑电路中驱动下一阶段分量。所有实验结果表明,溅射衍生的α-IGZO薄膜在大面积全氧化物柔性电子器件中具有潜在的应用。 (c)2018年elestvier b.v.保留所有权利。

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