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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Microstructural evolution and orientation-correlated origin of the coarsening behaviors in Au-Sn eutectic alloys
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Microstructural evolution and orientation-correlated origin of the coarsening behaviors in Au-Sn eutectic alloys

机译:Au-Sn共晶合金中粗化行为的微观结构演化与取向相关起源

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Au-Sn eutectic alloys are widely used in lead-free sealings and solders. Hot rolling, a process of the combination of deformation and heat, remains an attractive method to thin the solder strips for bulk ingots of Au-Sn eutectic alloys, but the mechanisms governing the hot rolling process of Au-Sn eutectic alloys is not yet clear. Solder strips thinning is thus not reached easily. In this study, the heat induced coarsening origin and spheroidization mechanisms in Au-Sn eutectic alloys were uncovered in terms of the microstructural evolution and orientation relationship. Microstructure evolution of lamellar colony of Au-Sn eutectic alloy revealed that the initiation sites of coarsening occurs at the boundary of the lamellar colony structure and the end of the lamellar fault inside the colony structure. Termination migration was found to dominate the origin of coarsening mechanism of Au-Sn eutectic alloy, with involving large scale nano-lamellae, paired lamellar faults and a large number of coarsening structure. And another new coarsening mechanism, lamellae splitting, was proposed based on "groove" morphology, interface structure and crystallographic orientation relationship, to create massive lamellar faults for termination migration. The mechanisms will provide a new insight into coarsening origin. And the results pave the way of hot rolling Au-Sn eutectic alloys in terms of parameter selection, microstructure evolution and coarsening mechanisms. (C) 2019 Elsevier B.V. All rights reserved.
机译:Au-Sn共晶合金广泛用于无铅密封和焊料。热轧,变形和热的组合的过程,仍然是薄焊条的散装锭剂的散装锭剂,但控制Au-Sn共晶合金的热轧过程的机制尚不清楚。因此,焊条稀疏变薄不易达到。在该研究中,就微观结构的演化和取向关系而揭示了Au-Sn共晶合金中的热诱导的粗化原点和球化机制。 Au-Sn共晶合金的层状菌落的微观结构演化显示,在菌落结构内部的层状菌落结构的边界和菌落结构内的层状故障的边界处发生粗化的起始位点。发现终止迁移占据Au-Sn共晶合金的粗化机理的起源,涉及大规模纳米薄片,配对层状故障和大量粗化结构。另一种新的粗化机制,基于“沟”形态,界面结构和晶体取向关系,提出了用于终止迁移的巨大层状断层的基于“沟槽”形态。机制将提供新的洞察粗兴起源。结果在参数选择,微观结构演化和粗化机制方面铺平了热轧AU-SN共晶合金的方法。 (c)2019 Elsevier B.v.保留所有权利。

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