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首页> 外文期刊>Journal of Applied Polymer Science >Epoxy terminated polysiloxane blended with diglycidyl ether of bisphenol-A. 1: Curing behavior and compatibility
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Epoxy terminated polysiloxane blended with diglycidyl ether of bisphenol-A. 1: Curing behavior and compatibility

机译:环氧封端的聚硅氧烷与双酚-A的二缩水甘油醚混合。 1:治疗行为和兼容性

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An epoxypropoxypropyl terminated polydimethylsiloxane (DMS-E09) is blended with a commercial epoxy resin [diglycidyl ether of bisphenol-A (DGEBA)], using methyl tetrahydrophthalic anhydride as a curing agent in the presence of the accelerator N, N-dimethyl benzyl amine. The co-curing behaviors, glass-transition temperature (T-g) are studied by differential scanning calorimetry (DSC) and curing kinetic parameters are calculated by Kissinger and Ozawa methods. It is found that the apparent activation energy for DMS-E09 is slightly lower than that of the DGEBA by 9-10 kJ mol(-1). Dynamic mechanical analysis is subsequently employed and reveals that the value of T-g (peak of tan delta at higher temperature) consists with the result of DSC very well. With the increase of DMS-E09 content, storage modulus and the values of T-g and T-beta (peak of tan delta at lower temperature) all have a tendency of decreasing monotonically. Furthermore, T-g and T-beta follow Fox and Gordon-Taylor expression well, indicating compatible networks in certain level are obtained. (c) 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46891.
机译:将环氧丙氧基丙基封端的聚二甲基硅氧烷(DMS-E09)与商业环氧树脂(DGENOL-A(DGEBA)的二缩水甘油醚)混合,在促进剂N,N-二甲基苄胺存在下使用甲基四氢邻苯基酸酐作为固化剂。通过差示扫描量热法(DSC)研究了共固化行为,玻璃化转变温度(T-G),并通过吻手柄和ozawa方法计算固化动力学参数。发现DMS-E09的表观活化能量略低于DGEBA的9-10kJ摩尔(-1)。随后使用动态力学分析,并揭示了T-G(较高温度下Tan Delta的峰值)的值包括DSC的结果。随着DMS-E09含量的增加,储存模量和T-G和T-Beta的值(较低温度下的Tanδ的峰值)均具有单调递减的趋势。此外,T-G和T-β伴随狐狸和戈登 - 泰勒表达良好,得到了一定水平的兼容网络。 (c)2018 Wiley期刊,Inc.J.Phill。聚合物。 SCI。 2018,135,46891。

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