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Hybrid high power impulse and radio frequency magnetron sputtering system for TiCrSiN thin film depositions: Plasma characteristics and film properties

机译:用于TiCrsin薄膜沉积的混合高功率脉冲和射频磁控溅射系统:等离子体特性和薄膜性能

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TiCrSiN thin films were successfully grown using a hybrid approach in which a high power impulse magnetron sputtering (HiPIMS) power was combined with a radio frequency (RF) power. Different Si contents were obtained by changing the RF power of Si target. The ion energy distribution functions (IEDFs) showed that the energy tails of all sputtered ions from the targets and sputtering gases shifted to a higher energy tails when the Si target power increased from 50 to 150 W. The peak power density of the TiCr target powered by HiPIMS and the corresponding Si content in the films increased from 1214 to 1350 W/cm(2) and from 0.2 to 17.9 at.%, respectively, as the Si target power increased from 50 to 150 W. The Si atoms were in the form of amorphous Si3N4 phase. The Si content showed a major influence on the microstructure, adhesion and mechanical properties of TiCrSiN film. Although a nanocomposite microstructure was formed when the Si content was 17.9 at.%, lower hardness and acceptable adhesion property were obtained due to a microstructure consisting of small TiN nanograins embedded in a large amount of soft amorphous silicon nitride matrix. The hardness of TiCrSiN film reached a maximum hardness of 31.1 GPa at Si = 6.7 at.% due to the refined microstructure and grain boundary hardening effect.
机译:TiCrSiN薄膜使用一种混合的方法成功地生长,其中,高功率脉冲磁控溅射(的HiPIMS)功率用射频(RF)功率组合。不同Si含量,通过改变Si靶的RF功率而获得。离子能量分布函数(IEDFs)表明,从靶溅射和所有的气体溅射离子的能量尾部偏移到更高的能量尾部当Si目标功率从50提高到150 W.供电TiCr籽目标的峰值功率密度通过的HiPIMS和在薄膜原子%,分别从1214增加至1350瓦/厘米(2)和0.2至17.9的相应的Si含量,作为Si目标功率从50提高到150个W的Si原子分别在形成非晶氮化硅相。 Si含量表明在微结构,粘附力和TiCrSiN膜的机械性能有重大影响。虽然当Si含量为17.9原子%,形成的纳米复合材料的微观结构,是由于由嵌入在大量软无定形氮化硅基质的小的TiN纳米晶粒的显微组织获得的较低的硬度和可接受的粘附性。 TiCrSiN膜的硬度,由于细化组织和晶界强化作用达到在硅= 6.7 31.1 GPa的最大硬度。%。

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