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首页> 外文期刊>The journal of physical chemistry, C. Nanomaterials and interfaces >Observation of the Direct Energy Band Gaps of Defect-Tolerant Cu3N by Ultrafast Pump-Probe Spectroscopy
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Observation of the Direct Energy Band Gaps of Defect-Tolerant Cu3N by Ultrafast Pump-Probe Spectroscopy

机译:超氮泵探针光谱观察缺陷耐缺陷Cu3N的直接能带间隙

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Cu3N with a cubic crystal structure has been prepared from Cu on fused SiO2 under a flow of NH3:O-2 between 400 and 600 degrees C. All Cu3N layers exhibited distinct maxima in differential transmission at similar to 500, 550, and 630, 670 nm with the same spectral structure and shape on a ps timescale as shown by ultrafast pump-probe spectroscopy. We show that the maxima at 630 ( 1.97 eV) and 670 nm ( 1.85 eV) correspond to the M and R direct energy band gaps of Cu3N, in excellent agreement with density functional theory calculations of the electronic band structure. These findings are corroborated further by the fact that Cu3N as-deposited by reactive sputtering under 100% N-2 at 25 degrees C and 10(-2) mbar did not exhibit a fine spectral structure due to a smeared density of states, poor crystallinity, and a high density of defects, but annealing under NH3:H-2 at 300 degrees C revealed a similar spectral structure to Cu3N obtained from Cu under NH3:O-2. In contrast to the above, we suggest that the peaks at 500 ( 2.48 eV) and 550 nm ( 2.25 eV) might correspond to the M and R direct gaps of certain regions of Cu3N under strain that changes the lattice constant and band gap. We discuss the charge carrier generation and recombination mechanisms in terms of Cu interstitials and vacancies that are known to be energetically located near the band edges, thus allowing the observation of the direct energy band gaps in this defect tolerant semiconductor.
机译:在400-600℃之间的NH 3:O-2的流动下由Cu在稠合SiO 2上制备了立方晶体结构的Cu3N。所有Cu3N层在类似于500,550和630,670的差速传输中表现出不同的最大值。具有相同的光谱结构和PS时间形状的形状,如超快泵探针光谱所示。我们表明,630(1.97eV)和670nm(1.85eV)的最大值对应于CU3N的M和R直接能带差距,与电子频带结构的密度泛函理论计算的优异一致。通过在25℃和10(-2)在100%N-2下通过在100%N-2下沉积的CU3N沉积的CU3N以25℃和10(-2)毫巴沉积的事实进一步证实了由于状态的涂片密度,结晶度差,因此没有表现出微谱结构和高密度的缺陷,但在300摄氏度下的NH 3:H-2下的退火显示出与在NH 3下的Cu下的Cu3N类似的光谱结构:O-2。与上述相反,我们建议使用500(2.48eV)和550nm(2.25eV)的峰值对应于在应变下的某些区域的M和R直接间隙,其变化晶格常数和带隙。我们讨论了在Cu间隙和空位方面讨论了收费载流子生成和重组机制,该空间和空位在带边缘附近能够在带边缘附近,从而允许观察在该缺陷耐受半导体中的直接能带间隙。

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