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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Thixoforming of semi-solid AZ91D alloy with high solid fraction prepared by the RUE-based SIMA process
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Thixoforming of semi-solid AZ91D alloy with high solid fraction prepared by the RUE-based SIMA process

机译:基于RUE为SIMA工艺制备高固体级分的半固体AZ91D合金的触变

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In the present study, semi-solid billets of AZ91D magnesium alloy were prepared by employing the repetitive upsetting-extrusion (RUE) based strain induced melt activation (SIMA) process. Thixoforming experiments were performed using semi-solid alloys experiencing various RUE temperatures and semi-solid reheating temperatures. The microstructure characterization and microhardness of the thixoformed products were investigated. Microstructure examination results indicated that semi-solid globular microstructure ensuring good thixotropic filling performance was prepared by applying the RUE-based SIMA method. Thixoformed components with good surface quality were obtained. Compared with the original as-cast alloy, significant grain refinement and microhardness improvement occurred in the thixoformed components. And the mean grain sizes and microhardness values were measured to be in the ranges of 11.81-23.84 mu m and Hv80.67-Hv90.65, respectively. By means of further comparison of microstructure and microhardness, the grain coarsening and microhardness reduction of the thixoformed components were verified by elevating the RUE deformation temperature and semi-solid remelting temperature. Furthermore, strengthening mechanisms during thixoforming involving the application of the RUE-based SIMA route were discussed in detail. The results showed that the comprehensive effect of fine grain strengthening, dispersion strengthening, and solid solubility strengthening should be responsible for microhardness improvement.
机译:在本研究中,通过使用重复镦挤出(RUE)诱导熔体激活(SIMA)工艺基于菌株制备AZ91D镁合金的半固态坯料。触变成形实验使用半固体合金经历各种RUE温度和半固体再加热的温度下进行。在触变成型产品的微观结构表征和显微硬度进行了研究。金相检验结果表明,半固体球状微结构确保良好的触变性填充性能,制备通过将基于RUE-SIMA方法。获得具有良好的表面质量触变成型部件。与原来的铸态合金相比,显著晶粒细化和硬度提高发生在触变成形部件。和平均晶粒尺寸和显微硬度值分别测定为在11.81-23.84亩范围m和Hv80.67-Hv90.65,分别。由组织及硬度的进一步比较的装置,所述晶粒粗化和触变成形部件的显微硬度减少了通过提高RUE变形温度和半固体重熔温度验证。此外,涉及基于RUE-SIMA路线的应用触变成形期间强化机制进行了详细讨论。结果表明,细晶强化,弥散强化和固溶强化的综合效应应该负责显微硬度提高。

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