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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Temperature-dependent electrical resistance of conductive polylactic acid filament for fused deposition modeling
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Temperature-dependent electrical resistance of conductive polylactic acid filament for fused deposition modeling

机译:用于融合沉积建模的导电聚乳酸长丝的温度依赖性电阻

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摘要

This study characterizes the microstructure and temperature dependence of resistance of two commercially available electrically conductive polylactic acid (PLA) composites for fused deposition modeling (FDM): PLA-carbon black and PLA-graphene. No microstructural changes were observed between the filament and the printed parts; however, the resistivity of the filament was found to drop by four to six times upon FDM. Also, compared to the resistivity of individual extruded wire, the resistivity of the printed parts was found to be up to 1500 times higher for PLA-graphene and up to 300 times higher for PLA-carbon black. The raw PLA-carbon black filament and printed wire showed a positive temperature coefficient of resistance ( α ) value between ~?0.03 and 0.01?°C_(?1), which makes them more suitable for sensor development. The raw PLA-graphene filament and printed wire did not exhibit a significant α , which makes them more suitable for printing wires. However, the parts made with multilayer FDM exhibited a negative or a negligible α up to a certain temperature prior to exhibiting a positive α ; further, these α values were significantly lower than those obtained for the filaments before or after extrusion. These findings enable proper selection of commercial conductive FDM filaments for enabling quicker prototyping of electronics and sensors.
机译:该研究表征了两种可商购的导电聚乳酸(PLA)复合材料的电阻的微观结构和温度依赖性,用于融合沉积建模(FDM):PLA-炭黑和PLA-石墨烯。灯丝与印刷部件之间没有观察到微观结构变化;然而,发现丝的电阻率在FDM时将四次降至六次。另外,与单独挤出线的电阻率相比,PLA-石墨烯的印刷部件的电阻率高达1500倍,PLA-炭黑高达300倍。原始PLA-炭黑灯丝和印刷线显示~~ 0.03和0.01Ω°C _(α1)之间的正温度系数(α)值,使其更适合传感器开发。原料PLA-石墨烯长丝和印刷线没有表现出显着的α,这使得它们更适合于印刷线。然而,在表现出阳性α之前,用多层FDM制备的部件在表现出α的阴性或忽略不计的α;此外,这些α值显着低于挤出前或之后的长丝获得的值。这些发现可以正确选择商用导电FDM长丝,以便能够更快地进行电子和传感器的原型设计。

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