...
首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Study on secondary cutting phenomenon of micro-textured self-lubricating ceramic cutting tools with different morphology parameters formed via in situ forming of Al2O3-TiC
【24h】

Study on secondary cutting phenomenon of micro-textured self-lubricating ceramic cutting tools with different morphology parameters formed via in situ forming of Al2O3-TiC

机译:用不同形貌参数通过原位形成Al2O3-TIC形成微纹理自润滑陶瓷切削工具二次切割现象研究

获取原文
获取原文并翻译 | 示例
           

摘要

Setting the micro-texture in the cutter-chip contact area of a micro-textured tool rake face can effectively improve the tool's cutting performance. However, an unreasonable design for the micro-groove morphology and size and the selection of inappropriate cutting parameters will cause a secondary cutting phenomenon during the cutting process. To explore the optimum microtexture morphology size and cutting parameters, micro-texture self-lubricating ceramic cutting tools with different morphology parameters (micro-texture location distribution: MSTD-1, MSTD-2, MSTD-3; groove spacing: MSTS-1, MSTS-2, MSTS-3; groove width: MSTW-1, MSTW-2, MSTW-3) were formed in situ and by hot pressing sintering, and a dry cutting 40Cr comparison test with a non-textured tool (MST-0) was conducted. The results revealed that the MSTD-2 tool effectively reduced the cutting force, friction factor, and rake face wear and relieved the secondary cutting phenomenon while cutting 40Cr. A theoretical analysis showed that the micro-texture morphology parameters and cutting speed were the main factors affecting the secondary cutting, with a smaller groove width and higher cutting speed associated with a lighter chip impact.
机译:在微纹理刀具耙面的刀片芯片接触面积中设置微观纹理可以有效地提高工具的切割性能。然而,对于微沟形态和尺寸和选择不适当的切割参数的无理设计将在切割过程中引起二次切割现象。探讨最佳的微织物形态尺寸和切割参数,微纹理自润滑陶瓷切削工具,具有不同的形态参数(微纹理定位分布:MSTD-1,MSTD-2,MSTD-3; Groove间距:MSTS-1, MSTS-2,MSTS-3;沟槽宽度:MSTW-1,MSTW-2,MSTW-3)原位形成,并通过热压烧结,以及具有非纹理工具的干切割40CR比较试验(MST-0 )是进行的。结果表明,MSTD-2工具有效地降低了切割力,摩擦系数和耙面磨损,并在切割40cr时减轻了二次切削现象。理论分析表明,微纹理形态参数和切割速度是影响二次切割的主要因素,具有较小的凹槽宽度和与更轻的芯片冲击相关的切削速度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号