Bostik showcases innovative adhesive solutions at PackPlus India

摘要

BOSTIK,adhesives specialist and subsidiary of French chemicals major,Arkema,recently showcased its products and technology for the packaging industry at the PackPlus India 2019,a leading exhibition on packaging,converting and supply chain industries.A key focus was on its range of laminating applications with solvent and solvent-free products that can be used across the flexible packaging industry.According to a recent report by research from PC Wood Mackenzie,demand for flexible packaging in the Indian market is estimated to grow at nearly 10 per cent a year over the next five years,currently estimated at $5.6-bn in 2017.