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Analysis and Modeling of Program Disturbance by Hot Carrier Injection in 3D NAND Flash Memory Using TCAD

机译:三维NAND闪存中的热载体扰动的分析与建模使用TCAD

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摘要

In this paper, we analyzed and modeled the program disturbance caused by hot carrier injection(HCI) in 3D NAND flash memory. HCI in 3D NAND occurs by band-to-band tunneling(BTBT) due to large electric field near the programming cell in the inhibited string. The dependency of HCI on electric field was confirmed at various bias conditions. Also, HCI modeling was done by calculating the exact electric field considering the change of channel potential over time due to BTBT.
机译:在本文中,我们分析并建模了3D NAND闪存中的热载体注射(HCI)引起的节目障碍。 3D NAND中的HCI由带对带隧道(BTBT)发生,由于禁止串的编程单元附近的大电场。 在各种偏置条件下证实了HCI对电场的依赖性。 此外,考虑到BTBT由于BTBT随着时间的推移而改变通道电位的变化,通过计算精确的电场来完成HCI建模。

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