Simulation of Microstructure Evolution during Static Recrystallization of Ultrafine-Grained Purity Copper

摘要

A modified cellular automata algorithm is proposed to simulate microstructure evolution during static recrystallization of ultrafine-grained purity copper. The effect of isothermal annealing and the extrusion pass of the equal channel angular pressing on the mean grain size of static recrystallization grains are considered. The results indicate that, during the annealing process, the growth of equiaxed grains is attributed to different nucleation times, grain growth velocities, as well as the interaction of the grains. Simulations comparing with the reported experimental data are included to demonstrate the expected properties of the proposed approach, and the slight differences between the two results are also pointed out due to the effect of non-uniform distribution of the stored energy on the nucleation during static recovery.