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Ultrafine Grain Evolution in Copper Alloys Induced by Mechanisms of Continuous Dynamic and Static Recrystallization

机译:连续动态和静态再结晶机理在铜合金中产生超细晶粒

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Ultrafine grained (UFGed) structure was uniformly evolved in a Cu-1.7mass%Fe alloy by the repeated cycles of thermo-mechanical processes (TMPs) of ⅰ) warm compression and annealing, and ⅱ) cold rolling and low temperature annealing. The UFGs possessed a slightly elongated shape of aspect ratio of 2 because of strong pinning effect boundaries by the Fe precipitates. The minimum grain size was about 0.7 μm. The UFG evolution was confirmed caused by recovery, i.e., continuous dynamic and continuous static recrystallizations. The repeated cycles of TMPs increased grain boundary misorientation angle gradually. Fe precipitates played an important role on substucture evolution as nodes of the dislocation networks and grain boundaries. The occurrence of discontinuous static and dynamic recrystallizations caused grain coarsening.
机译:通过ⅰ)热压缩和退火,ⅱ)冷轧和低温退火的热机械过程(TMP)的重复循环,在Cu-1.7质量%Fe合金中均匀地形成了超细晶粒(UFGed)结构。 UFG的长宽比为2,因为Fe析出物具有强的钉扎效应边界,因此形状稍长一些。最小晶粒尺寸为约0.7μm。 UFG的演化被证实是由回收引起的,即连续的动态和连续的静态重结晶。 TMPs的重复循环逐渐增加了晶界错位角。铁沉淀物作为位错网络和晶界的节点在亚基的演化中起着重要作用。静态和动态不连续再结晶的发生导致晶粒粗化。

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