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Characterization of Doped and Undoped Tin Oxide Thin Films Prepared by Sol Gel Spin Coating Technique

机译:溶胶凝胶旋涂技术制备掺杂和未掺杂的氧化锡薄膜的表征

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摘要

Optical and structural characterization of Cu-doped and pure SnO2 thin films were performed as a part of this investigation. In this respect, the effects of changing the concentration of the precursors on the thin film properties were investigated. Tin dioxide dun films both in pure and doped form were prepared by a sol gel spin coating technique. The metallic oxide (SnO2) films deposited were characterized using the UV Spectrophotometer and XRD studies. The average band gap for tin dioxide thin films was found to be approximately 3.80 eV. As far as direct band gap is concerned that copper doping appears to have no effect on the direct band gap which is in accordance with the literature. The indirect band gap for thin films was found to be approximately 3.48, 3.32 and 3.20 eV for different concentrations of the solutions, respectively. The indirect energy gap of the Cu doped thin films decreases as 3.76, 3.73 and 3.16 eV, respectively for different concentrations of the precursor solutions. The less value may be due to the addition of Cu-dopant and may also be due to growth of grain and improvement of the degree of crystallization.
机译:将Cu掺杂和纯SnO2薄膜的光学和结构表征作为本研究的一部分进行。在这方面,研究了改变前体浓度对薄膜性质的影响。通过溶胶凝胶旋转涂层技术制备纯净和掺杂形式的二氧化锡DUN膜。使用UV分光光度计和XRD研究表征沉积的金属氧化物(SnO2)膜。发现二氧化锡薄膜的平均带隙约为3.80eV。至于直接带隙担心铜掺杂似乎对根据文献的直接带隙没有影响。对于不同浓度的溶液,发现薄膜的间接带隙分别为约3.48,3.32和3.20eV。 Cu掺杂薄膜的间接能量间隙分别为3.76,3.73和3.16eV,分别用于不同浓度的前体溶液。值越少可能是由于加入Cu掺杂剂,也可能是由于晶粒的生长和结晶程度的增长。

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