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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Design of micro, flexible light-emitting diode arrays and fabrication of flexible electrodes
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Design of micro, flexible light-emitting diode arrays and fabrication of flexible electrodes

机译:微型柔性发光二极管阵列的设计和柔性电极的制造

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摘要

In this study, we design micro, flexible light-emitting diode (LED) array devices. Using theoretical calculations and finite element simulations, we analyze the deformation of the conventional single electrode bar. Through structure optimization, we obtain a three-dimensional (3D), chain-shaped electrode structure, which has a greater bending degree. The optimized electrodes not only have a bigger bend but can also be made to spin. When the supporting body is made of polydimethylsiloxane (PDMS), the maximum bending degree of the micro, flexible LED arrays (4 x 1 arrays) was approximately 230 mu m; this was obtained using the finite element method. The device (4 x 1 arrays) can stretch to 15%. This paper describes the fabrication of micro, flexible LED arrays using microelectromechancial (MEMS) technology combined with electroplating technology. Specifically, the isolated grooves are made by dry etching which can isolate and protect the light-emitting units. A combination of MEMS technology and wet etching is used to fabricate the large size spacing.
机译:在这项研究中,我们设计了微型柔性发光二极管(LED)阵列器件。使用理论计算和有限元模拟,我们分析了传统单电极棒的变形。通过结构优化,我们获得了具有较大弯曲度的三维(3D)链状电极结构。优化的电极不仅具有更大的弯曲度,而且还可以旋转。当支撑体由聚二甲基硅氧烷(PDMS)制成时,微型柔性LED阵列(4×1阵列)的最大弯曲度约为230μm。这是使用有限元方法获得的。该设备(4 x 1阵列)可以扩展到15%。本文介绍了使用微机电(MEMS)技术与电镀技术相结合的微型柔性LED阵列的制造方法。具体地,通过干蚀刻制成隔离的凹槽,该干蚀刻可以隔离和保护发光单元。结合使用MEMS技术和湿法蚀刻来制造大尺寸间距。

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