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首页> 外文期刊>Journal of Materials Science >Thermal stability of the engineered interfaces in W/ _f/W composites
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Thermal stability of the engineered interfaces in W/ _f/W composites

机译:W / _f / W复合材料中工程界面的热稳定性

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Application of tungsten as a structural material is severely restricted due to its inherent brittleness. Recently, a novel toughening method for tungsten was proposed by the authors using tungsten wires as reinforcement. The idea is analogous to the fiber-reinforced ceramic-matrix composites theory which utilizes the internal energy dissipation caused by the debonding and frictional sliding at the fiber/matrix interfaces to absorb strain energy and to redistribute stress concentrations over an extended volume. To maximize the energy dissipation, the interfaces need to be engineered by coating which can withstand thermal exposure during service. In this ork, we studied the thermal stability of various interfacial coatings after heat treatment. Microstructural change and the effect on mechanical properties were investigated by means of electron microscopy and fiber push-out tests. The results show that the microstructural phases of the analyzed interfaces remained relatively stable under hermal exposure of 800 °C for 10 h. Under such thermal exposure, the fracture energy of the Er/W multilayer and the ZrO _x/Zr multilayer were affected by less than 10%, while it was increased by 40% for the ZrO _x/W bilayer. The fracture energy of the C/W dual layer was decreased by a factor of 4, whereas for the Cu/W multilayer case it was increased by a factor of 2.
机译:钨由于其固有的脆性而受到严格限制。最近,作者提出了一种使用钨丝作为增强材料的新型钨增韧方法。这个想法类似于纤维增强的陶瓷基复合材料理论,该理论利用了因纤维/基体界面处的脱粘和摩擦滑动而引起的内部能量耗散,从而吸收了应变能并在扩展体积内重新分配了应力集中。为了最大程度地降低能量消耗,需要对接口进行涂层处理,使其在使用过程中能够承受热辐射。在此Ork中,我们研究了热处理后各种界面涂层的热稳定性。通过电子显微镜和纤维推出试验研究了微观结构变化及其对机械性能的影响。结果表明,在800°C的热暴露10 h下,所分析界面的微观结构相保持相对稳定。在这样的热暴露下,Er / W多层和ZrO_x / Zr多层的断裂能受到的影响小于10%,而ZrO_x / W双层的断裂能增加了40%。 C / W双层的断裂能降低了4倍,而Cu / W多层材料的断裂能提高了2倍。

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