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首页> 外文期刊>Journal of Materials Science >Synthesis, crystal stability, and electrical behaviors of La _(0.7)Sr _(0.3)Cr _(0.4)Mn _(0.6)O _(3-δ)-XCu _(0.75)Ni _(0.25) for its possible application as SOFC anode
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Synthesis, crystal stability, and electrical behaviors of La _(0.7)Sr _(0.3)Cr _(0.4)Mn _(0.6)O _(3-δ)-XCu _(0.75)Ni _(0.25) for its possible application as SOFC anode

机译:La _(0.7)Sr _(0.3)Cr _(0.4)Mn _(0.6)O _(3-δ)-XCu _(0.75)Ni _(0.25)的合成,晶体稳定性和电性能用作SOFC阳极

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摘要

La _(0.7)Sr _(0.3)Cr _(0.4)Mn _(0.6)O _(3-δ) (perovskite-type) nanocomposites impregnated with XCu _(0.75)Ni _(0.25) have been synthesized by sol-gel method. Crystal structure of LSCM-Cu _(0.75)Ni _(0.25) composites were refined by the Rietveld method. Crystal symmetry of CuO and NiO nanoparticles have monoclinic C12/c and cubic Fm3?m symmetry, respectively, but after sintering at 1,200 °C and reducing the temperature to 600 °C, it's transformed into a new Cu _(0.75)Ni _(0.25) intermetallic solid solution without secondary phase. We have detected a cationic inter-diffusion in Cu ? Ni interphase crystals during this reduction process; however, when sintering time exceeds 2 h at 1,200 °C this reaction mechanism is interrupted by a sublimation phenomenon; which causes Cu 2O cubic structure segregation from monoclinic CuO structure. This leads to Cu precipitation from the Cu 1-xNi x solid solution. Cu _(0.75)Ni _(0.25) inhibits the LSCM perovskite-type grain growth (? 220 nm). Electrical conductivity indicates the presence of semiconductor and metallic-type behaviors with a maximum electrical conductivity (800 °C)>4.5 (log r, Sm cm -1). When Cu _(0.75)Ni_0.25)concentration was 25 and 35 %, semiconductor behavior were dominated. Thermal expansion coefficients showed a linear dependence inversely proportional to Cu _(0.75)Ni _(0.25)concentration. Electrical conductivity, Rietveld analysis, Porosity, TEC, and Ea behaviors lead to the conclusion that the anodes between 25 and 35 % (Cu _(0.75)Ni _(0.25)) are closer to applications at SOFC.
机译:通过溶胶法合成了XCu _(0.75)Ni _(0.25)浸渍的La _(0.7)Sr _(0.3)Cr _(0.4)Mn _(0.6)O _(3-δ)(钙钛矿型)纳米复合材料-凝胶法。 LSCM-Cu _(0.75)Ni _(0.25)复合材料的晶体结构通过Rietveld方法进行了细化。 CuO和NiO纳米颗粒的晶体对称性分别具有单斜C12 / c和立方Fm3?m对称性,但是在1200°C烧结并降低温度至600°C后,它转变为新的Cu _(0.75)Ni _( 0.25)没有第二相的金属间固溶体。我们已经检测到Cu中的阳离子相互扩散。在还原过程中,Ni相晶体;但是,当烧结时间在1200°C下超过2 h时,该反应机理会因升华现象而中断;从而导致Cu 2O立方结构与单斜晶CuO结构分离。这导致Cu从Cu 1-xNi x固溶体中沉淀出来。 Cu_(0.75)Ni_(0.25)抑制了LSCM钙钛矿型晶粒的生长(≤220nm)。电导率表明存在半导体和金属类型的行为,最大电导率(800°C)> 4.5(log r,Sm cm -1)。当Cu _((0.75)Ni_0.25)的浓度为25%和35%时,半导体行为占主导。热膨胀系数显示出与Cu _(0.75)Ni _(0.25)浓度成反比的线性关系。电导率,Rietveld分析,孔隙率,TEC和Ea行为得出的结论是,介于25%和35%(Cu _(0.75)Ni _(0.25))之间的阳极更接近于SOFC的应用。

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