Enhancement of the thermal conductivity of aluminum oxide-epoxy terminated poly(dimethyl siloxane) with a metal oxide containing polysiloxane

摘要

Aluminum oxide containing poly(dimethylmethylvinyl) siloxane (PMDMS:Al _2O_3) was synthesized and blended with epoxy-terminated dimethylsiloxane (ETDS) to fabricate a thermally conducting composite. PMDMS:Al_2O_3 was added to provide interfacial interactions between the Al_2O_3 and polymer matrix. The PMDMS: Al _2O_3 containing composites revealed more enhanced thermal conduction properties because of the strengthened interfacial bonding at a fixed filler concentration. The conductivity as a function of the filler concentration was correlated with Agari's models. Based on the coefficient obtained from Agari's model, PMDMS:Al_2O_3 affected the formation of the conducting path in the composite. The results indicated that the presence of PMDMS:Al_2O_3 would help to establish a conducting path compared to compounds without it. All composites showed a decrease in thermal conductivity with increasing operating temperature. As expected, the PMDMS:Al_2O_3 containing composite (P-ETDS/Al_2O_3) showedmore enhanced thermal conductivity than those without, regardless of the operating temperature.