首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Fabrication of sandwich-type MgB2/Boron/MgB2 Josephson junctions with rapid annealing method
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Fabrication of sandwich-type MgB2/Boron/MgB2 Josephson junctions with rapid annealing method

机译:快速退火法制备三明治型MgB2 / Boron / MgB2 Josephson结

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Sandwich-type MgB2/Boron/MgB2 Josephson junctions were fabricated using magnetron sputtering system. The rapid-anneal process was adopted to replace traditional way of annealing, trying to solve the problem of interdiffusion and oxidation with multilayer films. The boron film was used as barrier layer to avoid the introduction of impurities and improve reproducibility of the junctions. The bottom MgB2 thin films deposited on c-plane sapphire substrate exhibits a critical temperature T-C of 37.5 K and critical current density J(C) at 5 K of 8.7 x 106 A cm(-2). From the XRD pattern, the bottom MgB2 thin film shows c-axis orientation, whereas the top MgB2 became polycrystalline as Boron barrier layer grown thicker. Therefore, all junction samples show lower T-C than single MgB2 thin film. The junctions exhibit excellent quasiparticle characteristics with ideal dependence on temperature and Boron barrier thickness. Sub-harmonic gap structure was appeared in conductance characteristics, which was attributed to the multiple Andreev reflections (MAR). The result demonstrates great promise of this new fabrication technology for MgB2 Josephson junction fabrication. (C) 2015 Elsevier B.V. All rights reserved.
机译:使用磁控溅射系统制造了三明治型MgB2 / Boron / MgB2 Josephson结。采用快速退火工艺代替了传统的退火方式,试图解决多层膜相互扩散和氧化的问题。硼膜被用作阻挡层,以避免引入杂质并提高结的再现性。沉积在c面蓝宝石衬底上的底部MgB2薄膜的临界温度T-C为37.5 K,在5 K时的临界电流密度J(C)为8.7 x 106 A cm(-2)。根据X射线衍射图,底部的MgB2薄膜显示c轴方向,而顶部的MgB2随着硼势垒层的增加而变成多晶。因此,所有结样品的T-C均低于单个MgB2薄膜。结表现出优异的准粒子特性,对温度和硼势垒厚度具有理想的依赖性。亚谐波间隙结构出现在电导特性中,这归因于多次安德烈夫反射(MAR)。结果证明了这种用于MgB2 Josephson结制造的新制造技术的巨大前景。 (C)2015 Elsevier B.V.保留所有权利。

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