Silver end termination paste preparation for chip inductor applications

摘要

A silver end termination paste fired at low temperature (600-650 degrees C) for chip inductor applications is developed in this work. The lead-free glass chemical composition and glass content in the silver paste effects on the densification, microstructure and interfacial reaction between the end termination and NiCuZn ferrites were investigated using scanning electron microscopy, electron probe microanalysis, X-ray diffractometer and dilatometer. The results show that nearly complete densification can be obtained for the paste added with 40 wt% B2O3 glass. Optimal glass Bi2O3 content (about 6.5 wt%) and glass content (about 15 wt%) are helpful in promoting adhesion strength due to interfacial reaction enhancement between the glass in the paste and NiCuZn ferrites. (C) 2015 Elsevier B.V. All rights reserved.