...
首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Enhancing the bio-corrosion resistance of Ni-free ZrCuFeAl bulk metallic glass through nitrogen plasma immersion ion implantation
【24h】

Enhancing the bio-corrosion resistance of Ni-free ZrCuFeAl bulk metallic glass through nitrogen plasma immersion ion implantation

机译:通过氮等离子体浸没离子注入提高无镍ZrCuFeAl大块金属玻璃的抗生物腐蚀能力

获取原文
获取原文并翻译 | 示例
           

摘要

Improving the resistance of bulk metallic glass (BMG) to corrosion, particularly pitting, is crucial to the further development of this material. This study employed surface treatment based on nitrogen plasma immersion ion implantation (N-PIII) to enhance the bio-corrosion resistance of Ni-free Zr_(62.5)Cu_(22.5)Fe_5Al_(10) BMG for application in bone implants. Resistance to bio-corrosion was evaluated by establishing poten-tiodynamic polarization curves in artificial saliva (AS) and simulated body fluid (SBF). Commercial pure Ti was used as the control. Results demonstrate that N-PIII treatment did not alter the bulk amorphous structure of Zr_(62.5)Cu_(22.5)Fe_5Al_(10) BMG. Following N-PIII treatment, a nitride-containing 15 nm thick oxide film was formed on the BMG. This film significantly improved resistance to bio-corrosion in both AS and SBF solutions. The N-PIII-treated BMG presented lower corrosion rates (50-67% less) and higher corrosion potential (800-1100 mV more) than that observed in untreated BMG and Ti. The N-PIII treatment also significantly improved resistance of the BMG to pitting (increased pitting potential by 500-700 mV). This is the first report of the outstanding resistance of Ni-free Zr-based BMG to bio-corrosion (i.e. corrosion rate 0.01μA/cm~2; pitting potential >1200mV; corrosion potential >270mV) in simulated biological environments.
机译:改进大块金属玻璃(BMG)的耐腐蚀性,特别是抗点蚀性,对于进一步开发这种材料至关重要。这项研究采用了基于氮等离子体浸没离子植入(N-PIII)的表面处理,以增强无镍Zr_(62.5)Cu_(22.5)Fe_5Al_(10)BMG在骨植入物中的生物耐腐蚀性。通过建立人工唾液(AS)和模拟体液(SBF)中的电位-动力动力学极化曲线来评估对生物腐蚀的抵抗力。商业纯钛用作对照。结果表明,N-PIII处理不会改变Zr_(62.5)Cu_(22.5)Fe_5Al_(10)BMG的整体非晶结构。在进行N-PIII处理之后,在BMG上形成了一个含氮化物的15 nm厚的氧化膜。该膜显着提高了AS和SBF解决方案中的抗生物腐蚀能力。与未处理的BMG和Ti相比,经N-PIII处理的BMG呈现出更低的腐蚀速率(降低了50-67%)和更高的腐蚀电位(超过800-1100 mV)。 N-PIII处理还显着提高了BMG对点蚀的抵抗力(点蚀电位增加了500-700 mV)。这是关于无镍Zr基BMG在模拟生物环境中具有出色的抗生物腐蚀性能的报道(即腐蚀速率0.01μA/ cm〜2;点蚀电位> 1200mV;腐蚀电位> 270mV)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号