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Electron-beam curing of bismaleimide-reactive diluent resins

机译:双马来酰亚胺反应性稀释剂树脂的电子束固化

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Electron-beam (E-beam) curing of 4,4'-bis-maleimidodiphenylmethane (BMPM)BMI-1,3-tolyl/o,o'-diallylbisphenol A (DABPA)-based bismaleimide (BMI) systems and their mixing, with various reactive diluents, such as N-vinylpyrrolidone (NVP) and styrene, were investigated to elucidate how temperature, electron-beam dosage, and diluent concentration affect the cure extent. The effect of free-radical initiator on the cure reactions was also studied. It was found that low-intensity E-beam exposures cannot cause the polymerization of BMI. High-intensity E-beam exposures give high reaction conversion attributed to a high temperature increase, which induced thermal curing. It was shown that the dilution and activation of NVP in BMI cause a more complete BMI cure reaction under E-beam radiation. BMI/NVP can be initiated easily by low-intensity E-beam without thermal curing. FTIR studies indicate that about 70% of the reaction is complete for BMI/NVP with 200 kGy dosage exposure at 10 kGy per pass. The sample temperature only reaches about 75degreesC. The free-radical initiator, dicumyl peroxide, can accelerate the reaction rate at the beginning of E-beam exposure, but does not affect the final reaction conversion. The increase of the concentration of NVP in the BMI/NVP systems increases the reactive conversions almost linearly. (C) 2004 Wiley Periodicals, Inc.
机译:4,4'-双马来酰亚胺基二苯甲烷(BMPM)BMI-1,3-甲苯基/ o,o'-二烯丙基双酚A(DABPA)基双马来酰亚胺(BMI)系统的电子束(E-beam)固化及其混合,用各种反应性稀释剂(例如N-乙烯基吡咯烷酮(NVP)和苯乙烯)进行研究,以阐明温度,电子束剂量和稀释剂浓度如何影响固化程度。还研究了自由基引发剂对固化反应的影响。发现低强度电子束暴露不会引起BMI聚合。高强度电子束曝露可归因于高温引起的高反应转化率,而高温会引起热固化。结果表明,BMI中NVP的稀释和活化引起电子束辐射下更完整的BMI固化反应。低强度电子束可轻松启动BMI / NVP,而无需热固化。 FTIR研究表明,对于BMI / NVP,大约200%的反应已完成,剂量为200 kGy,每次通过10 kGy。样品温度仅达到约75℃。自由基引发剂过氧化二枯基可在电子束暴露开始时加快反应速度,但不影响最终反应转化率。 BMI / NVP系统中NVP浓度的增加几乎线性地增加了反应转化率。 (C)2004年Wiley Periodicals,Inc.

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