Enhanced thermal stability of Cu-silylphosphido complexes via NHC ligation

摘要

The facile preparation and structural characterization of [M-6{P(SiMe3)(2)}(6)] (M = Ag, Cu) is reported. These complexes show limited stability towards solvent loss at ambient temperature; however, N-heterocyclic carbene (NHC) ligands were used to synthesize more thermally stable metal-silylphosphido compounds. 1,3-Di-isopropylbenzimidazole-2-ylidene (Pr-i(2)-bimy) and 1,3-bis(2,6-diisopropylphenyl)imidazol-2-ylidene (IPr) are found to be excellent ligands to stabilize silylphosphido copper compounds that show higher stability when compared to [Cu-6{P(SiMe3)(2)}(6)].