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Low temperature fabrication of indium-tin oxide film by using ionized physical vapor deposition method

机译:电离物理气相沉积法低温制备氧化铟锡薄膜

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Indium-tin oxide (ITO) films were successfully grown at low temperatures by ionized physical vapor deposition (IPVD) method, equipped with an internal-type inductively coupled plasma reactor (ICP-reactor). Radiofrequency antenna for ICP was made by Cu tube for the flow of cooling water, which was shielded by a quartz tube for excluding Cu-contamination from re-sputtering near the plasma field. Due to the high plasma density of IPVD, in-situ crystallization during the deposition of ITO film occurred even at the low temperatures, which lowers the sheet resistance. Therefore, IPVD could be used as an effective tool for low temperature processing devices such as plastic cover-unified touch sensors. (C) 2015 Elsevier B.V. All rights reserved.
机译:氧化铟锡(ITO)膜通过电离物理气相沉积(IPVD)方法在低温下成功生长,该方法配备了内部感应耦合等离子体反应器(ICP-reactor)。用于ICP的射频天线由用于冷却水流动的铜管制成,该铜管被石英管屏蔽,以防止铜污染在等离子场附近重新溅射。由于IPVD的高等离子体密度,即使在低温下,在ITO膜沉积过程中也会发生原位结晶,这降低了薄层电阻。因此,IPVD可以用作低温处理设备(例如塑料盖一体化触摸传感器)的有效工具。 (C)2015 Elsevier B.V.保留所有权利。

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